MANUFACTURING

XIINERGY'S FACTORY IS POWER MODULE PACKAGING FACILITY. WITH MATURE AND ADVANCED PACKAGING PROCESSES, WE PROVIDE EFFICIENT AND RELIABLE PACKAGING SERVICES, OFFERING CUSTOMERS HIGH QUALITY AND PROFESSIONAL MODULE PACKAGING SOLUTIONS. OUR ADVANCED PROCESSES AND EXPERT TECHNOLOGY ALLOW US TO QUICKLY RESPOND TO CUSTOMIZED REQUIREMENT.

ADVANCED POWER SEMICONDUCTOR MODULE PACKAGING FACILITY

XIINERGY’s manufacturing facility specializes in power module packaging and system integration, with a strong focus on the research and development of IGBT modules, IPMs (Intelligent Power Modules), and SiC hybrid modules. The company also provides customized packaging design and advanced thermal management solutions to meet the demands of high-performance power electronics applications.

To establish a high-quality product line that meets both automotive-grade and industrial-grade standards, the factory has introduced multiple sets of high-precision, high-reliability production and testing equipment. Micron-level high-precision placement machines ensure accurate alignment between chips and substrates, while vacuum reflow ovens maintain soldering stability through controlled environments and step-by-step temperature management. Aluminum and copper wire bonding machines enable efficient and reliable electrical connections, and dedicated testing systems simulate harsh operating conditions to conduct comprehensive performance validation.

With strong product quality and technical support capabilities, XIINERGY serves a wide range of applications, including electric vehicle drive systems, energy storage inverters, and high-end equipment manufacturing. The company remains fully committed to advancing the domestic substitution and technological development of high-performance power modules.

High Precision Placement Machine<br> AUTOTRONIC

High Precision Placement Machine
AUTOTRONIC

Equipped with a dual-vision alignment chip placer, the placement accuracy reaches ±0.015 mm. The gap between the chip and the Direct Bonded Copper (DBC) substrate is controlled within 5 µm. Customized vacuum suction nozzles and flexible pressure control achieve precise pressure adjustment from 0.1 g to 5 g, effectively avoiding the risk of hidden chip cracks. The placement yield rate is above 99.8%, laying the key foundation for the module's electrical conduction and thermal conductivity efficiency.

High Cleanliness Vacuum
Reflow Oven

CENTROTHERM vacuum reflow oven creates a high vacuum soldering environment of below 8 Pa. Oxygen concentration is strictly controlled below 30 ppm to prevent oxidation from the source. The solder joint void rate is precisely controlled under 0.3% (industry average: 3% to 5%). The system features a 32-zone independent temperature control system with a temperature ramp rate accuracy of ±0.3°C/s and soldering peak temperature fluctuation within ±0.8°C, achieving sub-micron metallurgical bonding between the chip and DBC substrate. Shear strength testing of solder joints shows a 50% increase in bonding strength. The joints can withstand thermal cycling from -55°C to 150°C for 1500 cycles without failure, fully meeting the durability and high reliability requirements of new energy vehicle power modules, industrial inverter equipment, and other long-life applications

High Precision Aluminum Wire<br> Bonding Machine

High Precision Aluminum Wire
Bonding Machine

The high precision bonding machine HESSE BJ955 can achieve a bonding position repeatability accuracy of ±0.005 mm, with bonding strength variation controlled within 5%. We use 99.99% high purity oxygen-free aluminum wire (diameter 0.2 to 0.8 mm). After parameter optimization, the current-carrying capacity of a single aluminum wire is increased by 25%, and the module's long-term current reliability is improved by 30%.

Comprehensive Testing Machine

LEMSYS professional static and dynamic test system can achieve a static force measurement accuracy of ±0.5% FS, a dynamic force test frequency range of 0.1 to 500 Hz, and a displacement measurement resolution of ≤0.1 μm This system ensures data accuracy from the very source. A 16-channel synchronous acquisition system with a sampling rate of up to 1 MHz and data acquisition latency of ≤10 μs enables millisecond-level dynamic capture of material mechanical properties. Verified through authoritative calibration, the system maintains a long-term test stability error of <0.3% and can withstand 800 environmental temperature cycles from -20°C to 80°C without drift. It fully meets the high precision mechanical testing requirements of automotive components, aerospace structural parts, and electronic devices, providing critical data support for product reliability validation.

PROCESS FLOW

OUR FACTORY FOCUSES ON MODULE PACKAGING AND TESTING

Yancheng factory focuses on module
packaging and testing

CHIP MOUNTING PROCESS

Our positioning accuracy reaches ±0.015 mm, with multiple nozzles and customizable adaptation for chips of various thicknesses and specifications.

We can precisely align the chip with the electrodes of the DBC (Direct Bonded Copper) substrate, preventing misalignment that could cause poor electrical connections, and providing a stable foundation for subsequent soldering and bonding processes.

ALUMINUM WIRE BONDING

We are capable of bonding aluminum and copper wires with diameters from 50 µm to 600 µm, achieving a positional repeatability of ±0.005 mm, while keeping bond-strength variation strictly within 5%.

We are capable of achieving micrometer-level connections between aluminum wires, chips, and substrates. This lays the foundation for stable electrical signal transmission in modules. Using a multi-strand parallel aluminum wire bonding design, parasitic inductance can be reduced to below 5 nH. This effectively minimizes signal interference under high frequency operation.

FORMIC-ACID REFLOW SOLDERING

Our power modules have excellent temperature uniformity at ±0.5%, single-solder-joint void rate below 0.5%, and a 15% reduction in thermal resistance of the solder layer.

As a key process for soldering IGBT chips to DBC substrates, formic-acid vacuum reflow soldering achieves flux-free soldering through a dual effect of ‘formic-acid reduction plus high-vacuum environment,’ preventing electrical corrosion caused by residues. The solder joint surface cleanliness reaches 99.9%, providing a solid foundation for the long-term current-carrying reliability of the module.

DYNAMIC/STATIC TESTING

Our power modules are equipped with a high precision measurement module, with a voltage testing range of 0 to 3000 V and a current testing range of 0 to 2000 A. The sampling rate reaches up to 20 GSa/s, testing bandwidth covers DC to 1 GHz, and it can simulate high frequency switching conditions from 5 kHz to 2 MHz.

As the final quality checkpoint before IGBT modules leave the factory, comprehensive testing is conducted on both static and dynamic electrical characteristics to ensure consistent product performance and reliability.

Static parameter testing includes key indicators such as breakdown voltage and gate threshold voltage, while dynamic characteristic testing covers critical performance factors such as switching delay time, di/dt, and dv/dt. These tests verify the module’s switching behavior, voltage tolerance, and overall operational stability under real-world working conditions.

This rigorous testing process ensures that only modules meeting precise electrical parameter standards are delivered to customers, effectively preventing underperforming or defective products from entering downstream applications. It serves as a critical safeguard for product quality, system reliability, and long-term operational safety in high-power electronic systems.

KEY PRODUCTS

XIINERGY SPECIALIZES IN WIDE-BANDGAP SEMICONDUCTOR TECHNOLOGIES (GAN/SIC), OUR PRODUCTS APPLICATIONS INCLUDE FAST CHARGING, ENERGY STORAGE SYSTEMS, AUTOMOTIVE ELECTRONICS, AND AI COMPUTING.

DEVELOPMENT PLAN

WE DEVELOP HIGHLY RELIABLE POWER MODULES TO MEET THE DEMANDS OF MARINE ELECTRONICS, WITH A COMMITMENT TO BECOMING A LEADING BRAND IN FUTURE MARINE ELECTRONIC EQUIPMENT.
WE DEVELOP HIGH-EFFICIENCY, HIGH-POWER-DENSITY POWER MODULES TO ADDRESS THE EVOLVING DEMANDS OF THE BATTERY INDUSTRY.
WE DESIGN EFFICIENT POWER MODULES FOR AI COMPUTING AND TERMINALS.
WE TACKLE HIGH-EFFICIENCY ENERGY CONVERSION CHALLENGES TO MEET THE DEMANDS OF HOME APPLIANCES.